Characterization of Next Generation Thin Low-K and Low-Loss Organic Dielectrics From 1 to 110 GHz

被引：8

作者：

Hwang, Seunghyun ^{[1
]}

Min, Sunghwan ^{[1
]}

Swaminathan, Madhavan ^{[1
]}

Venkatakrishnan, Venkatesan ^{[1
]}

Chan, Hunter ^{[1
]}

Liu, Fuhan ^{[1
]}

Sundaram, Venky ^{[1
]}

Kennedy, Scott ^{[2
]}

Baars, Dirk ^{[2
]}

Lacroix, Benjamin ^{[1
]}

Li, Yuan ^{[1
]}

Papapolymerou, John ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

[2] Rogers Corp, Rogers, CT 06263 USA

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2010年 / 33卷 / 01期

基金：

美国国家科学基金会;

关键词：

Cavity resonator; dielectric constant; loss tangent; millimeter-wave; surface roughness; CONSTANT;

D O I：

10.1109/TADVP.2009.2023413

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents, for the first time, characterization results of next generation dielectric core and build up material called RXP, which has low dielectric constant (2.93-3.48) and low loss tangent (0.0037-0.006) up to 110 GHz. Unlike LCP, this material can be made ultra-thin with low processing temperature and is ideally suited for mobile applications. Causal models suitable for high frequency applications have been extracted by measuring the response of cavity resonators using vector network analyzer and surface profiler.

引用

页码：180 / 188

页数：9

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