Modeling of Arbitrary Power-Ground Planes with Slot by Using Integral Equation and Transmission Line Method

被引:0
|
作者
Zou, Guo-Ping [1 ]
Li, Er-Ping [2 ]
Wei, Xing-Chang [2 ]
Cui, Xiang [1 ]
Luo, Guang-xiao [1 ]
机构
[1] North China Elect Power Univ, Sch Elect & Elect Engn, Beijing, Peoples R China
[2] A STAR Inst High Performance Comp, Adv Electromagnet Elect, Singapore, Singapore
关键词
Electronic packaging; equivalent circuit; integral equation; power/signal integrity;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A coupled integral equation equivalent circuit (IEEC) and transmission line (TML) method is used to model the gapped power-ground planes. The integral equation equivalent circuit method can model an arbitrary shaped power-ground pair with much less time than usual commercial software. However, in gaped planes, there is strong coupling between the two sides of narrow slot, so the coupling effects should be taken into account in the modeling. In this model, the segmental lumped circuits of coupled microstrip lines are integrated to the equivalent circuit, which is deprived by the integral equation equivalent circuit method for arbitrary shaped power-ground (PG) planes. The proposed method has been examined by using he commercial simulator HFSS through several examples.
引用
收藏
页码:2428 / +
页数:2
相关论文
共 50 条
  • [1] Efficient modeling of rerouted return currents in multilayered power-ground planes by using integral equation
    Wei, Xing-Chang
    Li, Er-Ping
    Liu, En-Xiao
    Xing Cui
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2008, 50 (03) : 740 - 743
  • [2] Emission and susceptibility modeling of finite-size power-ground planes using a hybrid integral equation method
    Wei, Xing-Chang
    Li, Er-Ping
    Liu, En-Xiao
    Chua, Eng-Kee
    Oo, Zaw-Zaw
    Vahldieck, R.
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2008, 31 (03): : 536 - 543
  • [3] Extraction of Equivalent Network of Arbitrarily Shaped Power-Ground Planes With Narrow Slots Using a Novel Integral Equation Method
    Wei, Xing-Chang
    Zou, Guo-Ping
    Li, Er-Ping
    Cui, Xiang
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2010, 58 (11) : 2850 - 2855
  • [4] Delaunay-Voronoi modeling of power-ground planes with source port correction
    Wu, Kai-Bin
    Shiue, Guang-Hwa
    Guo, Wei-Da
    Lin, Chien-Min
    Wu, Ruey-Beei
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2008, 31 (02): : 303 - 310
  • [5] A Discontinuous Galerkin Time-Domain Method for Modeling of Power-Ground Planes with Narrow Slots and Signal Vias
    Lee, Hui Min
    Gao, Si-Ping
    Liu, En-Xiao
    2017 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC), 2017, : 288 - 290
  • [6] On 2-D transmission line modeling of power and ground planes in multilayer structures
    IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 2000, : 95 - 98
  • [7] On 2-D transmission line modeling of power and ground planes in multilayer structures
    Tarvainen, T
    Kolehmainen, J
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2000, : 95 - 98
  • [9] Two-Dimensional Discontinuous Galerkin Time-Domain Method for Modeling of Arbitrarily Shaped Power-Ground Planes
    Lee, Hui Min
    Gao, Siping
    Liu, En-Xiao
    Samudra, G. S.
    Li, Er-Ping
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2015, 57 (06) : 1744 - 1747
  • [10] Analytical Extraction of Via-Via Inductance by Using SMM for Power-Ground Planes
    Luo, Guang-Xiao
    Wei, Xing-Chang
    Cui, Xiang
    Li, Er-Ping
    2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2011,