Electron-Related Phenomena at the TaN/Al2O3 Interface

被引:11
|
作者
Rao, Rosario [1 ,2 ]
Lorenzi, Paolo [1 ,2 ]
Ghidini, Gabriella [3 ]
Palma, Fabrizio [1 ,2 ]
Irrera, Fernanda [1 ,2 ]
机构
[1] Univ Roma La Sapienza, Dipartimento Ingn Elettron, I-00184 Rome, Italy
[2] Italian Univ, NET, Rome, Italy
[3] Numonyx, I-20041 Agrate Brianza, Italy
关键词
Electron trapping; interface degradation; metal/high-k interface; pulsed C-V technique; OXIDE INTERFACE; CHARGE; TECHNOLOGY;
D O I
10.1109/TED.2009.2039100
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The goal of this work is to study the transient electrical features of metal/high-k interface in MOS stacks. To this aim, electrons are injected from the gate of TaN/Al2O3/SiO2/p-Si capacitors in pulsed regime. The displacement current flowing during the pulse front is detected, and the capacitance is extracted. As a result, for the first time, a flat-band instability related to electron trapping in states near the metal/high-k interface is measured on a millisecond timescale. A picture of the time evolution of the charge density inside the oxide bulk is drawn, with the aid of a finite-element simulator. Reliability of the metal/high-k interface is also investigated by performing stress experiments in pulsed conditions. It is shown that after a certain number of pulses, the creation of new traps at the top interface of the MOS stack becomes relevant.
引用
收藏
页码:637 / 643
页数:7
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