The Linux TCP/IP stack contributions have recently pointed all in the same direction: maximize the available throughput while maintaining low latency. These activities started by mitigating the buffebloat phenomenon at the network bottleneck as much as possible. So far, the deployed solutions have been designed by considering standard models for the bottleneck that could be either wireless or wired. The introduction of Wi-Fi 6 is dislocating the bottleneck of standard home and office WLAN from the radio access point to the 1 Gbps interface, the wired interface that points to the internet service provider; this bottleneck migration leads to a new real-case bottleneck model, which is hybrid. Such an environment embraces new technologies and provides new challenges for the old TCP protocol when applied to hybrid bottlenecks and operating in conjunction with the TCP side-modules, which are now part of the novel Linux kernels. This paper aims to highlight the TCP performance considering the new TCP modules and novel scenarios opened by Wi-Fi 6 with real-case hybrid bottlenecks.
机构:Samsung Elect Silicon Valley R&D Ctr, San Jose, CA USA
Au, Edward
Cheong, Minho
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机构:Samsung Elect Silicon Valley R&D Ctr, San Jose, CA USA
Cheong, Minho
Ngo, Chiu
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Samsung Elect Silicon Valley R&D Ctr, San Jose, CA USASamsung Elect Silicon Valley R&D Ctr, San Jose, CA USA
Ngo, Chiu
Cordeiro, Carlos
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Intel Corp, Mobile & Commun Grp, Santa Clara, CA 95051 USASamsung Elect Silicon Valley R&D Ctr, San Jose, CA USA
Cordeiro, Carlos
Zhuang, Weihua
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Univ Waterloo, Waterloo, ON N2L 3G1, Canada
Canadian Acad Engn, Ottawa, ON, Canada
Engn Inst Canada, Kingston, ON, CanadaSamsung Elect Silicon Valley R&D Ctr, San Jose, CA USA
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Marvell Technol Grp, Santa Clara, CA 95054 USAMarvell Technol Grp, Santa Clara, CA 95054 USA
Au, Edward
Cheong, Minho
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Nevvracom Inc, Irvine, CA USA
ETRI, Taejon, South KoreaMarvell Technol Grp, Santa Clara, CA 95054 USA
Cheong, Minho
Ngo, Chiu
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Samsung Elect Silicon Valley R&D Ctr, Stand & Technol Enabling Grp, Mountain View, CA USA
IET, Stevenage, Herts, EnglandMarvell Technol Grp, Santa Clara, CA 95054 USA
Ngo, Chiu
Cordeiro, Carlos
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Intel Corp, Platform Engn Grp, Santa Clara, CA 95051 USAMarvell Technol Grp, Santa Clara, CA 95054 USA
Cordeiro, Carlos
Zhuang, Weihua
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Univ Waterloo, Waterloo, ON N2L 3G1, CanadaMarvell Technol Grp, Santa Clara, CA 95054 USA
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Chiba Univ, Grad Sch Sci & Engn, Chiba 2638522, JapanChiba Univ, Grad Sch Sci & Engn, Chiba 2638522, Japan
Aoyagi, Shunji
Horie, Yuki
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Chiba Univ, Grad Sch Sci & Engn, Chiba 2638522, JapanChiba Univ, Grad Sch Sci & Engn, Chiba 2638522, Japan
Horie, Yuki
Hien, Do Thi Thu
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Vietnam Natl Univ Ho Chi Minh City VNU HCM, Univ Informat Technol, Ho Chi Minh City 700000, VietnamChiba Univ, Grad Sch Sci & Engn, Chiba 2638522, Japan
Hien, Do Thi Thu
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Ngo, Thanh Duc
Le, Duy-Dinh
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Vietnam Natl Univ Ho Chi Minh City VNU HCM, Univ Informat Technol, Ho Chi Minh City 700000, VietnamChiba Univ, Grad Sch Sci & Engn, Chiba 2638522, Japan
Le, Duy-Dinh
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Nguyen, Kien
Sekiya, Hiroo
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Chiba Univ, Grad Sch Sci & Engn, Chiba 2638522, JapanChiba Univ, Grad Sch Sci & Engn, Chiba 2638522, Japan