Design of new passive THZ devices based on micromachining techniques

被引：0

作者：

Biber, S ^{[1
]}

Schür, J ^{[1
]}

Hofmann, A ^{[1
]}

Schmidt, L ^{[1
]}

机构：

[1] Univ Erlangen Nurnberg, Inst Microwave Technol, D-91058 Erlangen, Germany

来源：

MSMW'04: FIFTH INTERNATIONAL KHARKOV SYMPOSIUM ON PHYSICS AND ENGINEERING OF MICROWAVES, MILLIMETER, AND SUBMILLIMETER WAVES, SYMPOSIUM PROCEEDINGS, VOLS 1 AND 2 | 2004年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present an overview on the latest results using micromachining techniques for the fabrication of THz-components. Different machining techniques will be discussed with respect to their capability to generate complex 3-dimensional geometries with high aspect ratios and to meet the high mechanical requirements for THz-components. Exemplary results for the application of micromachining techniques for the design of new components will be reviewed. We will emphasize the potential of silicon based microstructures for the manufacturing of new devices.

引用

页码：26 / 31

页数：6

共 18 条

[1] FABRICATION OF NOVEL 3-DIMENSIONAL MICROSTRUCTURES BY ANISOTROPIC ETCHING OF (100) AND (110) SILICON [J].

BASSOUS, E .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 1978, 25 (10) :1178-1185

[2]

BIBER S, 2003, P EUR MICR WEEK MUN

[3]

BRANDT M, 2002, P FAR IR SUBMM MM DE

[4]

Chris Seung-Bok Lee, 1998, Technical Digest. Solid-State Sensor and Actuator Workshop, P45

[5]

Ederra I., 2003, IEEE Antennas and Propagation Society International Symposium. Digest. Held in conjunction with: USNC/CNC/URSI North American Radio Sci. Meeting (Cat. No.03CH37450), P1087

[6] High-aspect-ratio micromachining via deep x-ray lithography [J].

Guckel, H .

PROCEEDINGS OF THE IEEE, 1998, 86 (08) :1586-1593

[7] Analysis of an octagonal micromachined horn antenna for submillimeter-wave applications [J].

Hesler, JL ;

Hui, K ;

Dahlstrom, RK ;

Weikle, RM ;

Crowe, TW ;

Mann, CM ;

Wallace, HB .

IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2001, 49 (06) :997-1001

[8]

IVES L, 2003, 28 INT C INFR MILL W, P249

[9] Bulk micromachining of silicon [J].

Kovacs, GTA ;

Maluf, NI ;

Petersen, KE .

PROCEEDINGS OF THE IEEE, 1998, 86 (08) :1536-1551

[10] Bosch deep silicon etching: Improving uniformity and etch rate for advanced MEMS applications [J].

Laermer, F ;

Schilp, A ;

Funk, K ;

Offenberg, M .

MEMS '99: TWELFTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 1999, :211-216

← 1 2 →