CLEANING TECHNOLOGY IN SEMICONDUCTOR DEVICE MANUFACTURING V
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1998年
/
35卷
关键词:
D O I:
暂无
中图分类号:
O646 [电化学、电解、磁化学];
学科分类号:
081704 ;
摘要:
Adsorption and cohesion properties among micro particles have strong contribution to the cleaning process in micro device manufacturing. These properties are analyzed by both force detection and direct removal techniques with an AFM micro tip. The slight difference from DMT theory for tip-particle adsorption can be observed, and deformation of particle is affected to the interaction. Experimental results for removing one of PSL particles directly are demonstrated by means of scratching, indentation and manipulation with the AFM tip.