Schottky Barrier Height Reduction at Interface Between GZO Transparent Electrode and InP/InGaAs Structure by Zinc Driven-in Step and Nickel Oxide Insertion
In this letter, we report the characteristics of transparent Ga-doped ZnO (GZO) electrodes contacted to the InP/InGaAs epitaxial structure both with and without a NiOx inserting layer. The GZO films deposited onto the p-InP/InGaAs structure by both radio-frequency sputtering and plasma-mode atomic layer deposition always yield Schottky contact characteristics. The barrier height improvement at the n-GZO/p-InP interface is proposed using dual zinc driven-in steps and a NiOx insertion layer to realize ohmic characteristics. The high zinc concentration (5-8 x 10(18) cm(-3)) is first obtained in the surface of the p-InP window layer via the dual zinc driven-in steps. By inserting a NiOx layer between the GZO and Au/Cr contact films, the Au/Cr/GZO/NiOx contact pad for zinc driven-in p-InP window layer and the postannealing process of 430 degrees C for 180 s exhibits a good ohmic contact behavior and a low specific contact resistance of 3.07 x 10(-4) Omega cm(2).