Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications

被引：61

作者：

Li, RL ^{[1
]}

DeJean, G ^{[1
]}

Maeng, M ^{[1
]}

Lim, K ^{[1
]}

Pinel, S ^{[1
]}

Tentzeris, MM ^{[1
]}

Laskar, J ^{[1
]}

机构：

[1] Georgia Inst Technol, Ctr Elect Design, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2004年 / 27卷 / 04期

关键词：

compact antennas; embedded antennas; low-temperature cofired ceramics (LTCC) packages; multilayer RF modules; wireless communications;

D O I：

10.1109/TADVP.2004.831866

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A simple procedure for the design of compact stacked-patch antennas is presented based on LTCC multilayer packaging technology. The advantage of this topology is that only one parameter, i.e., the substrate thickness (or equivalently the number of LTCC layers), needs to be adjusted in order to achieve an optimized bandwidth performance. The validity of the new design strategy is verified through applying it to practical compact antenna design for several wireless communication bands, including ISM 2.4-GHz band, IEEE 802.11a 5.8-GHz, and LMDS 28-GHz band. It is shown that a 10-dB return-loss bandwidth of 7% can be achieved for the LTCC (epsilon(r) = 5.6) multilayer structure with a thickness of less than 0.03 wavelengths, which can be realized using a different number of laminated layers for different frequencies (e.g., three layers for the 28-GHz band).

引用

页码：581 / 589

页数：9

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