Resistive GP-SIMD Processing-In-Memory

被引:23
作者
Morad, Amir [1 ]
Yavits, Leonid [1 ]
Kvatinsky, Shahar [1 ]
Ginosar, Ran [1 ]
机构
[1] Technion Israel Inst Technol, Elect Engn, IL-3200003 Haifa, Israel
关键词
GP-SIMD; SIMD; processing in memory; PIM; in-memory computing; memristor; resistive RAM; Design; Performance; Energy; ARCHITECTURE; DESIGN;
D O I
10.1145/2845084
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
GP-SIMD, a novel hybrid general-purpose SIMD architecture, addresses the challenge of data synchronization by in-memory computing, through combining data storage and massive parallel processing. In this article, we explore a resistive implementation of the GP-SIMD architecture. In resistive GP-SIMD, a novel resistive row and column addressable 4F(2) crossbar is utilized, replacing the modified CMOS 190F(2) SRAM storage previously proposed for GP-SIMD architecture. The use of the resistive crossbar allows scaling the GP-SIMD from few millions to few hundred millions of processing units on a single silicon die. The performance, power consumption and power efficiency of a resistive GP-SIMD are compared with the CMOS version. We find that PiM architectures and, specifically, GP-SIMD benefit more than other many-core architectures from using resistive memory. A framework for in-place arithmetic operation on a single multivalued resistive cell is explored, demonstrating a potential to become a building block for next-generation PiM architectures.
引用
收藏
页数:22
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共 43 条
  • [1] High precision tuning of state for memristive devices by adaptable variation-tolerant algorithm
    Alibart, Fabien
    Gao, Ligang
    Hoskins, Brian D.
    Strukov, Dmitri B.
    [J]. NANOTECHNOLOGY, 2012, 23 (07)
  • [2] Alibart Fabien, 2011, 2011 NASA ESA C AD H, P279, DOI [10.1109/AHS.2011.5963948, DOI 10.1109/AHS.2011.5963948]
  • [3] [Anonymous], 2010, 2010 IEEE INT S PAR
  • [4] [Anonymous], 2011, Proceedings of the Design, Automation Test in Europe
  • [5] Burger D., 1997, Computer Architecture News, V25, P13, DOI 10.1145/268806.268810
  • [6] Cassuto Y, 2013, IEEE INT SYMP INFO, P156, DOI 10.1109/ISIT.2013.6620207
  • [7] Chang MF, 2015, ISSCC DIG TECH PAP I, V58, P318, DOI 10.1109/ISSCC.2015.7063054
  • [8] Chang MT, 2013, INT S HIGH PERF COMP, P143, DOI 10.1109/HPCA.2013.6522314
  • [9] Chen YC, 2003, 2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST, P905
  • [10] Chung E. S., 2010, Proceedings 2010 43rd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO 2010), P225, DOI 10.1109/MICRO.2010.36