THERMODEL: a tool for compact dynamic thermal model generation

被引:47
作者
Szekely, V [1 ]
机构
[1] Tech Univ Budapest, Dept Electron Devices, H-1521 Budapest, Hungary
关键词
Number:; -; Acronym:; EC; Sponsor: European Commission; T017463; OTKA; Sponsor: Hungarian Scientific Research Fund;
D O I
10.1016/S0026-2692(97)00065-7
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
THERMODEL is a software tool which generates compact thermal models to describe the heat conduction of three-dimensional physical structures, from either the time-domain or the frequency-domain response of the given structure. The generated compact model consists of a single (or twin) RC ladder of 8-12 stages. Both the one-port and the transfer thermal behavior can be modeled. These compact models can be useful in circuit-level simulators (like SPICE or ELDO) where thermal effects have to be considered in the model or in the electro-thermal integrated circuit chip simulators where all the relevant thermal couplings of the chip can be modeled in this way. (C) 1998 Published by Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:257 / 267
页数:11
相关论文
共 8 条
[1]  
Jansson P. A., 1984, DECONVOLUTION
[2]  
MULLER O, 1963, AEU-ARCH ELEKTRON UB, V17, P13
[3]   MONOLITHIC OP AMP - TUTORIAL STUDY [J].
SOLOMON, JE .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1974, SC 9 (06) :314-332
[4]  
*SYSTUS, 1994, US MAN REV B
[5]   ON THE REPRESENTATION OF INFINITE-LENGTH DISTRIBUTED RC ONE-PORTS [J].
SZEKELY, V .
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS, 1991, 38 (07) :711-719
[6]   Electro-thermal simulation: A realization by simultaneous iteration [J].
Szekely, V ;
Poppe, A ;
Rencz, M ;
Csendes, A ;
Pahi, A .
MICROELECTRONICS JOURNAL, 1997, 28 (03) :247-262
[7]  
SZEKELY V, IN PRESS IEEE T CIRC
[8]  
SZEKELY V, 1996, P 2 THERMINIC WORKSH, P13