Flexible processing of large scale LCD panels using scanner deflected UV-laser radiation

被引:0
作者
Ostendorf, A [1 ]
Körber, K [1 ]
Temme, T [1 ]
Bann, B [1 ]
Apte, P [1 ]
Haberzettl, H [1 ]
Budischewski, T [1 ]
机构
[1] Laser Zentrum Hannover eV, Hannover, Germany
来源
MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY VI | 2000年 / 4174卷
关键词
LCD; material ablation; micro-machining; UV-laser;
D O I
10.1117/12.396441
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
In this paper, a technology and a machine tool is presented, which can be implemented in the production of Liquid Crystal Displays (LCDs), leading to a higher flexibility and reduced manufacturing costs. The developed technology focuses on the generation of transfer points by selective removal of polyimide on an Indium Tin Oxide (ITO) layer with UV-laser radiation, thus replacing the conventional stamping method with cliches. With the combination of xy-stages and galvanometer scanner beam deflection, panels with dimensions of up to 400 x 500 mm(2) can be processed. On test panels, the required 2000 transfer points, distributed on the entire panel, can be processed in step and scan mode in about 30 s with an accuracy of better than 20 mum. The yield of the new technology in terms of working displays is comparable to the current technology. Besides LCD production, the developed machine tool has a high potential in the field of micro and precision engineering on large scale panels. The machine is highly versatile and can be used to perform a wide variety of processes in organic and inorganic materials for volume production as well as for research.
引用
收藏
页码:256 / 266
页数:11
相关论文
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