The future of microelectronics

被引：13

作者：

Chatterjee, PK ^{[1
]}

Doering, RR ^{[1
]}

机构：

[1] Texas Instruments Inc, Dallas, TX 75265 USA

来源：

PROCEEDINGS OF THE IEEE | 1998年 / 86卷 / 01期

关键词：

diffusion; etching; life-cycle costing; lithography; manufacturing; microelectromechanical devices; microprocessors; semiconductor materials; thin films; year; 2000;

D O I：

10.1109/5.658769

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

[No abstract available]

引用

页码：176 / 183

页数：8

共 13 条

[1]

CASTRUCCI P, 1995, SOLID STATE TECH JAN, P49

[2]

CHATTERJEE PK, 1993, IEEE T VLSI SYST, V1

[3]

DOERING RR, 1994, 1994 SYMPOSIUM ON VLSI TECHNOLOGY, P31, DOI 10.1109/VLSIT.1994.324392

[4]

DOERING RR, 1995, SOLID STATE TECHNOL, V38, P60

[5]

DOERING RR, 1993, NIKKEI MICRODEVI SEP, P74

[6]

DOERING RR, 1992, 6 INT SAMP EL MAT PR

[7]

DOERING RR, 1993, P 4 INT S ULSI SCI T, P133

[8]

DOERING RR, 1992, 1992 S VLSI TECHN SE

[9]

DOERING RR, 1994, SOLID STATE TECH JAN, P31

[10] SINGLE-WAFER INTEGRATED SEMICONDUCTOR-DEVICE PROCESSING [J].

MOSLEHI, MM ;

CHAPMAN, RA ;

WONG, M ;

PARANJPE, A ;

NAJM, HN ;

KUEHNE, J ;

YEAKLEY, RL ;

DAVIS, CJ .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 1992, 39 (01) :4-32

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