Microstructure, hardness, and shear behavior of Sn3.0Ag0.5Cu?Sn58Bi composite solder joint

被引：7

作者：

Liu, Yang ^{[1
]}

Liu, Li ^{[1
]}

Xu, Ruisheng ^{[1
]}

Sun, Fenglian ^{[1
]}

Zhu, Dongdong ^{[2
]}

Xu, Haitao ^{[2
]}

机构：

[1] Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin, Heilongjiang, Peoples R China

[2] Quzhou Univ, Key Lab Air Driven Equipment Technol Zhejiang Pro, Quzhou, Peoples R China

来源：

MATERIALS RESEARCH EXPRESS | 2019年 / 6卷 / 11期

基金：

中国国家自然科学基金;

关键词：

SnAgCu; SnBi; microstructure; hardness; shear behavior; MECHANICAL-PROPERTIES; RELIABILITY; EVOLUTION;

D O I：

10.1088/2053-1591/ab508e

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this study, Sn3.0Ag0.5Cu-Sn58Bi (SAC-SnBi) composite solder joint was obtained by two-step soldering process. The microstructure, hardness, and shear performance of the composite solder joint were investigated in comparison with the eutectic Sn58Bi (SnBi) and SnAgCu (SAC) solder joints. Experimental results showed that the SAC-SnBi had similar intermetallic compound (IMC) morphology and thickness with the SAC solder joints. Compared with the eutectic SnBi solder, the large Bi-rich matrix transforms into tiny Bi-rich grains in the SAC-SnBi solder bulk. Tiny Bi-rich grains, Cu6Sn5, and Ag3Sn distribute uniformly in the composite solder bulk. As the SnBi bulk melts into the SAC solder during the second soldering process, the formation and growth of large ?-Sn dendritic in SAC solder is suppressed in the composite solder. Therefore, the SAC-SnBi composite joint shows higher hardness and shear strength than the other two.

引用

页数：7

共 50 条

[31] Effect of Cu6Sn5 nanoparticles addition on properties of Sn3.0Ag0.5Cu solder joints
Lv, Ziwen
Wang, Jintao
Wang, Fengyi
Zhang, Weiwei
Wang, Jianqiang
Hang, Chunjin
Chen, Hongtao
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 34 (08)
[32] Investigation of Stress Evolution at the Interface of Cu/Sn3.0Ag0.5Cu/Cu Solder Joint during Electromigration
He Hongwen
Zhao Haiyan
Ma Limin
Xu Guangchen
Guo Fu
RARE METAL MATERIALS AND ENGINEERING, 2012, 41 : 401 - 404
[33] The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing
Tian, Yu
Wang, Yishu
Guo, Fu
Ma, Limin
Han, Jing
JOURNAL OF ELECTRONIC MATERIALS, 2019, 48 (05) : 2770 - 2779
[34] Effect of Trace Boron Nitride Nanoparticles on the Microstructure and Shear Properties of Sn58Bi Solder Joint
Yang, Li
Liu, Zheng
Xu, Yuhang
Li, Yangyang
Zhong, Jiawen
Wang, Xiangyu
Zhang, Yaocheng
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2024, 33 (18) : 9336 - 9345
[35] Effects of small amount addition of rare earth Y on microstructure and property of Sn3.0Ag0.5Cu solder
Li, Hui
Key Engineering Materials, 2014, 584 : 3 - 8
[36] Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates
Hu, Xiaowu
Xu, Tao
Keer, Leon M.
Li, Yulong
Jiang, Xiongxin
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 690 : 720 - 729
[37] Effect of Mo Nanoparticles on the Growth Behavior of the Intermetallic Compounds Layer in Sn3.0Ag0.5Cu/Cu Solder Joints
Yang, Linmei
Quan, Shanyu
Liu, Cong
Xiong, Hao
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2020, 20 (04) : 2573 - 2577
[38] The properties of intermetallic compounds at Sn3.0Ag0.5Cu/Cu joint interface
Shu, X.-F., 1600, Journal of Functional Materials, P.O. Box 1512, Chongqing, 630700, China (44):
[39] Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3.0Ag0.5Cu solder interconnects
Wang, Shaobin
Yao, Yao
Wang, Wenjie
ENGINEERING FRACTURE MECHANICS, 2018, 202 : 259 - 274
[40] Effect of co on the morphology and mechanical properties of the Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joints on ENEPIG surface
Zhang, Shuai
Jing, Xinyi
Zhang, Shang
Chen, Jieshi
Paik, Kyung-Wook
He, Peng
Zhang, Shuye
MATERIALS CHARACTERIZATION, 2024, 209

← 1 2 3 4 5 →