Effects of Microcrack Evolution on the Electrical Resistance of Cu Thin Films on Flexible PI Substrates During Cyclic-Bend Testing

被引：8

作者：

Bag, Atanu ^{[1
]}

Park, Ki-Seong ^{[1
]}

Choi, Shi-Hoon ^{[1
]}

机构：

[1] Sunchon Natl Univ, Dept Printed Elect Engn, Sunchon 57922, South Korea

来源：

METALS AND MATERIALS INTERNATIONAL | 2017年 / 23卷 / 04期

基金：

新加坡国家研究基金会;

关键词：

metals; thin films; cyclic bending; scanning electron microscopy (SEM); electrical properties; ARTIFICIAL SKIN APPLICATIONS; MECHANICAL-PROPERTIES; DAMAGE FORMATION; FATIGUE LIFE; STRAIN; TRANSPARENT; ELECTRODES; THICKNESS; GRAPHENE; MATRIX;

D O I：

10.1007/s12540-017-6735-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Cyclic-bend testing was conducted on flexible Cu-clad laminate (FCCL) to investigate the correlation between electrical resistance and the evolution of microcracks. During the test, the change in the electrical resistance of the FCCL was monitored using two-point probe method. The variation in the electrical resistance of the FCCL with respect to the bending cycle can be divided into three stages according to the slope. In order to reveal the microcracks in Cu thin film and how they contribute to the variation in electrical resistance, quantitative analysis of the microcracks was conducted on the surface and cross-section of the deformed Cu thin films using field emission scanning electron microscopy. Analysis showed that the simultaneous extensive evolution of microcracks in the tension and compression zones were main contributors to increase the electrical resistance following specific critical bending cycles.

引用

页码：673 / 682

页数：10

共 41 条

[1] Graphene oxide-based flexible metal-insulator-metal capacitors [J].