Electrochemical Migration of Sintered Nanosilver Under Chloride-Containing Thin Electrolyte Layer for Power Electronic Packaging

被引:3
作者
Zheng, Yana [1 ,2 ,3 ]
Mei, Yunhui [1 ,2 ,3 ]
Long, Fei [4 ]
Li, Xin [2 ,3 ]
Yan, Chaoyi [2 ,3 ]
Lu, Guo-Quan [1 ,5 ]
机构
[1] Tianjin Univ, Minist Educ, Key Lab Adv Ceram & Machining Technol, Tianjin 300072, Peoples R China
[2] Tianjin Univ, Tianjin Key Lab Adv Joining Technol, Tianjin 300072, Peoples R China
[3] Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300072, Peoples R China
[4] Inst Machinery Mfg Technol, Mianyang, Sichuan, Peoples R China
[5] Virginia Tech, Dept Mat Sci & Engn, Blacksburg, VA 24061 USA
基金
国家高技术研究发展计划(863计划); 中国国家自然科学基金;
关键词
electrochemical migration; electronic materials; scanning electron microscopy; sintered nanosilver; x-ray diffraction; x-ray photoelectron spectrometer; PRINTED-CIRCUIT BOARD; SN-3.0AG-0.5CU SOLDER; SILVER MIGRATION; IN-SITU; TIN; RESISTANCE; CORROSION; PASTE; DEPENDENCE; DENDRITES;
D O I
10.5006/1909
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The electrochemical migration (ECM) of sintered nanosilver in thin electrolyte layers with various chloride concentrations was investigated by in situ and ex situ characterizations. There are two ECM products, i.e., the cloud-like layer and branched dendrites, in both electrolytes with 0 ppm and 10 ppm of NaCl. Only the dendrites, however, could be observed in 100, 200, and 300 ppm NaCl electrolyte layers. The cloud-like layer product is attributed to formation and reduction of Ag2O. However, the formation of Ag2O is inhibited by formation of AgCl in 100, 200, and 300 ppm NaCl electrolyte layers. No ECM products were present in 400 ppm NaCl electrolyte layer, but precipitates of silver compounds were because of formation of insoluble precipitates at anodes. A proposed mechanism has been discussed experimentally in order to understand the effect of Cl- on the electrochemical migration of sintered nanosilver.
引用
收藏
页码:547 / 559
页数:13
相关论文
共 41 条
  • [1] Thermomechanical reliability of low-temperature sintered silver die attached SiC power device assembly
    Bai, John Guofeng
    Lu, Guo-Quan
    [J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2006, 6 (03) : 436 - 441
  • [2] The atmospheric corrosion of quaternary bronzes: An evaluation of the dissolution rate of the alloying elements
    Bernardi, E.
    Chiavari, C.
    Martini, C.
    Morselli, L.
    [J]. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2008, 92 (01): : 83 - 89
  • [3] Brad A.J., 2000, Electrochemical Methods: Fundamentals and Applications, V2nd
  • [4] METAL MIGRATIONS OUTSIDE THE PACKAGE DURING ACCELERATED LIFE TESTS
    DUMOULIN, P
    SEURIN, JP
    MARCE, P
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1982, 5 (04): : 479 - 486
  • [5] XPS surface chemical characterization of atmospheric particles of different sizes
    Guascito, Maria R.
    Cesari, Daniela
    Chirizzi, Daniela
    Genga, Alessandra
    Contini, Daniele
    [J]. ATMOSPHERIC ENVIRONMENT, 2015, 116 : 146 - 154
  • [6] Effect of ionization characteristics on electrochemical migration lifetimes of Sn-3.0Ag-0.5Cu solder in NaCl and Na2SO4 solutions
    Jung, Ja-Young
    Lee, Shin-Bok
    Lee, Ho-Young
    Joo, Young-Chang
    Park, Young-Bae
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (08) : 1111 - 1118
  • [7] Characterization of Ag-Pd Nanocomposite Paste for Electrochemical Migration Resistance
    Kim, Kwang-Seok
    Jung, Kwang-Ho
    Park, Bum-Geun
    Shin, Young-Eui
    Jung, Seung-Boo
    [J]. JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2013, 13 (11) : 7620 - 7624
  • [8] Fabrication of a Hydrogen Sensor using Palladium-coated Silver Dendrites Formed Electrochemically
    Lee, Shin-Bok
    Lee, Ho-Young
    Lee, Eunsongyi
    Lee, Wooyoung
    Joo, Young-Chang
    [J]. METALS AND MATERIALS INTERNATIONAL, 2010, 16 (05) : 789 - 792
  • [9] Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area (> 100 mm2) Chips
    Lei, Thomas Guangyin
    Calata, Jesus Noel
    Lu, Guo-Quan
    Chen, Xu
    Luo, Shufang
    [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2010, 33 (01): : 98 - 104
  • [10] Monolayer protection for eletrochemical migration control in silver nanocomposite
    Li, Yi
    Wong, C. P.
    [J]. APPLIED PHYSICS LETTERS, 2006, 89 (11)