A High Performance Normally-Off AlGaN/GaN Split-Gate Metal-Insulator-Semiconductor High Electron Mobility Transistor (MIS-HEMT) Using Piezo Neutralization Technique

被引:2
作者
Su, Xuebing [1 ,3 ]
Wang, Yang [1 ,3 ]
Jin, Xiangliang [2 ,3 ]
Yang, Hongjiao [1 ,3 ]
机构
[1] Xiangtan Univ, Sch Phys & Optoelect, Xiangtan 411105, Hunan, Peoples R China
[2] Hunan Normal Univ, Sch Phys & Elect, Changsha 410012, Hunan, Peoples R China
[3] Hunan Engn Lab Microelect Optoelect & Syst Chip, Xiangtan 411105, Hunan, Peoples R China
基金
中国国家自然科学基金;
关键词
GaN; MIS-HEMT; Split; -Gate; PNT; High Threshold Voltage; GAN FET; VOLTAGE; DESIGN;
D O I
10.1166/jno.2022.3185
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we propose a novel normally-off MIS-HEMT structure, mainly using Split-Gate Technology, Piezo Neutralization Technique (PNT), Field Plate Technology. By analyzing the effects of different Al composition in the PNT layer and buffer layer on devices, the Piezo Neutralization Technique is optimized. The current turn-on/off is controlled by changing gate voltage to regulate the horizontal conduction band between the double gates. The effects of gate length and block barrier size between the double gates on device performance are studied. Through two-dimensional device simulation, the operation principle and internal mechanism are analyzed. An improved device with good performance is presented. The threshold voltage V-th is 4.1 V, the peak transconductance is 0.3 S/mm, the maximum drain current is 1.1 A/mm and the breakdown voltage is 1200 V.
引用
收藏
页码:202 / 210
页数:9
相关论文
共 27 条
[1]   Effect of Fluoride-based Plasma Treatment on the Performance of AlGaN/GaN MISHFET [J].
Ahn, Ho-Kyun ;
Kim, Hae-Cheon ;
Kang, Dong-Min ;
Kim, Sung-Il ;
Lee, Jong-Min ;
Lee, Sang-Heung ;
Min, Byoung-Gue ;
Yoon, Hyoung-Sup ;
Kim, Dong-Young ;
Lim, Jong-Won ;
Kwon, Yong-Hwan ;
Nam, Eun-Soo ;
Park, Hyoung-Moo ;
Lee, Jung-Hee .
ETRI JOURNAL, 2016, 38 (04) :675-684
[2]  
[Anonymous], 2018, URB STORM DRAIN CRIT
[3]   Enhancement-Mode AlGaN/GaN MIS-HEMTs With High VTH and High IDmax Using Recessed-Structure With Regrown AlGaN Barrier [J].
Asubar, Joel Tacla ;
Kawabata, Shinsaku ;
Tokuda, Hirokuni ;
Yamamoto, Akio ;
Kuzuhara, Masaaki .
IEEE ELECTRON DEVICE LETTERS, 2020, 41 (05) :693-696
[4]  
Bipolar/BiCMOS Circuits and Technology, 2004, P 2004 M, P198
[5]   High-performance enhancement-mode AlGaN/GaN HEMTs using fluoride-based plasma treatment [J].
Cai, Y ;
Zhou, YG ;
Chen, KJ ;
Lau, KM .
IEEE ELECTRON DEVICE LETTERS, 2005, 26 (07) :435-437
[6]   GaN-on-Si Power Technology: Devices and Applications [J].
Chen, Kevin J. ;
Haeberlen, Oliver ;
Lidow, Alex ;
Tsai, Chun Lin ;
Ueda, Tetsuzo ;
Uemoto, Yasuhiro ;
Wu, Yifeng .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017, 64 (03) :779-795
[7]   Performance characterization of gallium nitride HEMT cascode switch for power conditioning applications [J].
Chou, Po-Chien ;
Cheng, Stone .
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, 2015, 198 :43-50
[8]  
He Y., 2019, PHYS STATUS SOLIDI A, V216, P1
[9]  
He Y., 2017, APPL PHYS DELIVERED, V10, P1
[10]   High Breakdown Voltage in RF AlN/GaN/AlN Quantum Well HEMTs [J].
Hickman, Austin ;
Chaudhuri, Reet ;
Bader, Samuel James ;
Nomoto, Kazuki ;
Lee, Kevin ;
Xing, Huili Grace ;
Jena, Debdeep .
IEEE ELECTRON DEVICE LETTERS, 2019, 40 (08) :1293-1296