Performance and thermal behavior of wood plastic composite produced by nonmetals of pulverized waste printed circuit boards

被引:40
作者
Guo, Jie [1 ]
Tang, Yinen [1 ]
Xu, Zhenming [1 ]
机构
[1] Shanghai Jiao Tong Univ, Sch Environm Sci & Engn, Shanghai 200240, Peoples R China
基金
国家高技术研究发展计划(863计划);
关键词
Printed circuit boards; Wood plastic composite; Screw withdrawal strength; Thermogravimetric analysis; RECOVERY; SURFACE;
D O I
10.1016/j.jhazmat.2010.02.080
中图分类号
X [环境科学、安全科学];
学科分类号
08 ; 0830 ;
摘要
A new kind of wood plastic composite (WPC) was produced by compounding nonmetals from waste printed circuit boards (PCBs), recycled high-density polyethylene (HOPE), wood flour and other additives. The blended granules were then extruded to profile WPC products by a conical counter-rotating twin-screw extruder. The results showed that the addition of nonmetals in WPC improved the flexural strength and tensile strength and reduced screw withdrawal strength. When the added content of nonmetals was 40%, the flexural strength of WPC was 23.4 MPa, tensile strength was 9.6 MPa, impact strength was 3.03 J/m(2) and screw withdrawal strength was 1755 N. Dimensional stability and fourier transform infrared spectroscopy (FTIR) of WPC panels were also investigated. Furthermore, thermogravimetric analysis showed that thermal degradation of WPC mainly included two steps. The first step was the decomposition of wood flour and nonmetals from 260 to 380 degrees C, and the second step was the decomposition of HDPE from 440 to 500 degrees C. The performance and thermal behavior of WPC produced by nonmetals from PCBs achieves the standard of WPC. It offers a novel method to treat nonmetals from PCBs. (c) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码:203 / 207
页数:5
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