2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications

被引：2

作者：

Huang, Po-Tsang ^{[1
]}

Wu, Shang-Lin ^{[1
]}

Huang, Yu-Chieh ^{[1
]}

Chou, Lei-Chun ^{[1
]}

Huang, Teng-Chieh ^{[1
]}

Wang, Tang-Hsuan ^{[1
]}

Lin, Yu-Rou ^{[1
]}

Cheng, Chuan-An ^{[1
]}

Shen, Wen-Wei ^{[1
]}

Chuang, Ching-Te ^{[1
]}

Chen, Kuan-Neng ^{[1
]}

Chiou, Jin-Chern ^{[1
]}

Hwang, Wei ^{[1
]}

Tong, Ho-Ming ^{[1
]}

机构：

[1] Natl Chiao Tung Univ, Hsinchu 300, Taiwan

来源：

IEEE TRANSACTIONS ON BIOMEDICAL CIRCUITS AND SYSTEMS | 2014年 / 8卷 / 06期

关键词：

Analog front-end (AFE); configurable discrete wavelet transform (DWT); low-power ADC; neural sensing microsystem; on-interposer bus; through-silicon-via (TSV); 2.5D heterogeneous integration; mu-probes; SAR ADC; AMPLIFIER; CIRCUIT;

D O I：

10.1109/TBCAS.2014.2385061

中图分类号：

R318 [生物医学工程];

学科分类号：

0831 ;

摘要：

Heterogeneously integrated and miniaturized neural sensing microsystems are crucial for brain function investigation. In this paper, a 2.5D heterogeneously integrated bio-sensing microsystem with mu-probes and embedded through-silicon-via (TSVs) is presented for high-density neural sensing applications. This microsystem is composed of mu-probes with embedded TSVs, 4 dies and a silicon interposer. For capturing 16-channel neural signals, a 24 x 24 mu-probe array with embedded TSVs is fabricated on a 5 x 5 mm2 chip and bonded on the back side of the interposer. Thus, each channel contains 6 x 6 mu-probes with embedded TSVs. Additionally, the 4 dies are bonded on the front side of the interposer and designed for biopotential acquisition, feature extraction and classification via low-power analog front-end (AFE) circuits, area-power-efficient analog-to-digital converters (ADCs), configurable discrete wavelet transforms (DWTs), filters, and a MCU. An on-interposer bus (mu-SPI) is designed for transferring data on the interposer. Finally, the successful in-vivo test demonstrated the proposed 2.5D heterogeneously integrated bio-sensing microsystem. The overall power of this microsystem is only 676.3 mu W for 16-channel neural sensing.

引用

页码：810 / 823

页数：14

共 37 条

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