LDMOSFET and SiGe:C HBT integrated in a 0.25μm BiCMOS technology for RF-PA applications.

被引:4
作者
Muller, D [1 ]
Giry, A [1 ]
Arnaud, C [1 ]
Arricastres, C [1 ]
Sommet, R [1 ]
Szelag, B [1 ]
Monroy, A [1 ]
Pache, D [1 ]
机构
[1] STMicroelect, Ctr Commun Microelect Crolles, F-38921 Crolles, France
来源
PROCEEDING OF THE 2004 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING | 2004年
关键词
D O I
10.1109/BIPOL.2004.1365771
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An optimized LDMOSFET and a SiGe:C HBT for PA design integrated in a BiCMOS technology are described in this article. Each device interest for PA application is highlighted via their electrical performances -static, small and large signal-.
引用
收藏
页码:168 / 171
页数:4
相关论文
共 5 条
[1]  
BAUDRY H, BCTM 2003, P207
[2]  
HARAME D, ESSDERC 2002 P, P53
[3]  
LARSON L, IEDM 2002 SHORT COUR
[4]  
SZELAG B, ESSDERC 2003, P39
[5]   High performance silicon LDMOS technology for 2GHz RF power amplifier applications. [J].
Wood, A ;
Dragon, C ;
Burger, W .
IEDM - INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST 1996, 1996, :87-90