3D small-field surface imaging based on microscopic fringe projection profilometry:a review

Intelligent manufacturing has become more precise, miniaturized and integrated. Representative integrated circuit technology and its derived miniature sensors such as Micro-Electro-Mechanical System (MEMS) have become widely used. Therefore, it is important for intelligent manufacturing development to accurately obtain the surface morphology information of micro-devices and implement rapid detection of device surface defects. Fringe Projection Profilometry (FPP) based on structural light projection has the advantages of being non-contact, highly precise, highly efficient and having full-field measurement, which plays an important role in the field of precision measurement. Microscopic Fringe Projection Profilometry (MFPP) has been developed rapidly during recent decades. In recent years, MFPP has made great progress in many aspects, including its optical system structures, corresponding system calibration methods, phase extraction algorithms, and 3D coordinate reconstruction methods. In this paper, the structure and principle of a three-dimensional measurement system of microscopic fringe projection are reviewed, and the calibration problem of a small field-of-view system that is different from the traditional projection model is analyzed. After that, the development and improvement process of the micro-projection system structure is introduced, and the reflection in the measurment caused by the system structure and metal material is analyzed. On this basis, the prospects of the development of microscopic fringe projection of 3D measurement system are discussed.