Thickness Measurement of Thin Soft Organic Films

被引:0
作者
Mladenova, Daniela [1 ,2 ]
Siderov, Vasil [3 ]
Zhivkov, Ivaylo [1 ,2 ]
Salyk, Ota [1 ]
Ohlidal, Miloslav [4 ]
Yordanova, Irena [3 ]
Yordanov, Roumen [3 ]
Philippov, Philipp [3 ]
Weiter, Martin [1 ]
机构
[1] Brno Univ Technol, Ctr Mat Res, Fac Chem, CS-61090 Brno, Czech Republic
[2] Bulgarian Acad Sci, Inst Opt Mat & Technol Acad J Malinowski, Sofia, Bulgaria
[3] Tech Univ Sofia, Dept Microelect, Sofia, Bulgaria
[4] Brno Univ Technol, Inst Engn Phys, Dept Opt & Precise Mech, CS-61090 Brno, Czech Republic
来源
2012 35TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2012): POWER ELECTRONICS | 2012年
关键词
ELECTROPHORETIC DEPOSITION; POLYMER-FILMS;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper compares chromatic white light (CWL) and interference microscope measurements aiming to find a proper non-contact method for a thickness determination of thin soft organic films. Standard samples with vacuum deposited aluminum films of different thicknesses in the range of 50-1000 nm were prepared and measured by both methods. It was found that the CWL technique is proper for a measurement of thin soft organic films with higher than 40-50 nm film thicknesses. As a complementary feature of the method 2D and 3D surface morphology imaging of the films could be recorded and the surface film roughness could be calculated. In a case of optical inhomogeneity the method requires covering with a uniform high reflective coating. The interference microscopy method results in a relatively lower film thickness with a higher standard deviation and a higher standard relative error. It could be connected with the resolution of the interferograms measured.
引用
收藏
页码:367 / 372
页数:6
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