In situ device processing using shadow mask selective area epitaxy and in situ metallization

被引:2
|
作者
Luo, Y [1 ]
Zeng, L
Lin, W
Yang, B
Tamargo, MC
Strzhemechny, YM
Schwarz, SA
机构
[1] CUNY City Coll, Ctr Adv Technol Photon Mat & Applicat, Ctr Anal Struct & Interfaces, Dept Chem, New York, NY 10031 USA
[2] CUNY, Grad Sch, New York, NY 10031 USA
[3] CUNY, Univ Ctr, New York, NY 10031 USA
[4] CUNY Queens Coll, Dept Phys, Flushing, NY 11367 USA
关键词
molecular beam epitaxy; selective area epitaxy; shadow mask; in situ device processing; Au/CdTe;
D O I
10.1007/s11664-000-0051-2
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A concept for in situ device processing has been demonstrated by the fabrication of Au/CdTe device like structures using shadow mask selective area epitaxy (SAE) and in situ metallization. Patterned CdTe epilayers were grown in the molecular beam epitaxy (MBE) chamber using shadow mask SAE (in situ patterning) and then directly transferred within ultrahigh vacuum (UHV) into a metal evaporation chamber for patterned Au deposition (in situ metallization). Excellent pattern definitions of both the CdTe and Au layers were obtained. Good metal adhesion properties and low levels of contamination at the metal-semiconductor interface were observed. A specially designed mask fixture that allows the mask to be placed and removed within the UHV chamber was implemented to perform this work.
引用
收藏
页码:598 / 602
页数:5
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