Reliability of NAND Flash Arrays: A Review of What the 2-D-to-3-D Transition Meant

被引:63
作者
Compagnoni, Christian Monzio [1 ]
Spinelli, Alessandro S. [1 ]
机构
[1] Politecn Milan, Dipartimento Elettron Informaz & Bioingn, I-20133 Milan, Italy
关键词
Flash memories; Reliability; Arrays; Market research; Tunneling; Programming; Image color analysis; 3-D NAND Flash arrays; semiconductor device modeling; semiconductor device reliability; RANDOM TELEGRAPH NOISE; THRESHOLD-VOLTAGE DISTRIBUTION; INJECTION STATISTICS; MEMORIES; MODEL; RETENTION; DEVICES; CELL; INTERFERENCE; SUPPRESSION;
D O I
10.1109/TED.2019.2917785
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reviews what changed in the reliability of NAND Flash memory arrays after the paradigm shift in technology evolution determined by the transition from 2-D to 3-D integration schemes. Starting from a quick glance at the fundamentals of raw array reliability, the reasons for its worsening with the evolution of 2-D technologies will be discussed, focusing on the physical phenomena which contributed more to that outcome. By exploring the dependence of the magnitude of these phenomena on cell and array parameters, the abrupt improvements achieved from the 3-D transition in terms of raw array reliability will then be explained, highlighting also that these improvements were turned into new opportunities for the technology. Finally, the physical issues specific to 3-D arrays will be addressed, providing a glimpse of the challenges that the NAND Flash technology will have to face from the standpoint of array reliability in the near future.
引用
收藏
页码:4504 / 4516
页数:13
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