Numerical Simulation of HTPB Resin Curing Process Using OpenFOAM and Study the Effect of Different Conditions on its Curing Time

被引：15

作者：

Moghimi Rad, Hamed ^{[1
]}

Tavangar Roosta, Saeed ^{[1
]}

Motamed Shariati, Seyed Hadi ^{[1
]}

Ghorban Hosseini, Seyed ^{[1
]}

机构：

[1] Malek Ashtar Univ Technol, Dept Chem Engn, Tehran, Iran

来源：

PROPELLANTS EXPLOSIVES PYROTECHNICS | 2021年 / 46卷 / 09期

关键词：

Polymer curing; HTPB; OpenFOAM; Fan oven; Curing mold geometry; KINETICS; CURE; MODEL;

D O I：

10.1002/prep.202000321

中图分类号：

O69 [应用化学];

学科分类号：

081704 ;

摘要：

The main purpose of this study is to optimize the curing time of HTPB, by analyzing the curing process in different conditions. Solving equations have been performed using OpenFOAM software and according to the finite volume method. To solve the curing equation, a new solver called CureFOAM was developed and added to the OpenFOAM. Using the experimental results available in the sources, the developed solver was validated. The maximum relative error is +5 %. After validating the CureFOAM solver, the effect of various factors affecting the curing process was simulated. Based on the results, an increase of 10 degrees C temperature reduces curing time to 2 days, and the use of a fan oven in the Reynolds 1500 range, reduces curing time by up to 50 percent. Also, the curing process in the mold of a rectangular cube is done faster than the cylindrical and spherical molds, in different aspect ratios.

引用

页码：1447 / 1457

页数：11

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