Evaluation of the interfacial bonding between particles and substrate in angular cold spray

被引:46
作者
Chen, Chaoyue [1 ]
Xie, Yingchun [1 ]
Yin, Shuo [2 ]
Planche, Marie-Pierre [1 ]
Deng, Sihao [1 ]
Lupoi, Rocco [2 ]
Liao, Hanlin [1 ]
机构
[1] UTBM, UBFC, IRTES, LERMPS, F-90100 Belfort, France
[2] Univ Dublin Trinity Coll, Dept Mech & Mfg Engn, Parsons Bldg, Dublin 2, Ireland
关键词
Cold spray (CS); Metallurgical bonding; Spray angle; Interface; Finite element analysis (FEA); IMPACT; ALUMINUM; DIFFUSION; MECHANISM; FEATURES; COPPER; NI;
D O I
10.1016/j.matlet.2016.03.036
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Investigation on a single particle deposition onto a polished substrate is an effective way to well understand the coating/substrate bonding mechanism in cold spray. But existing studies on this topic are always limited to the particle surface morphology and cross-section observation. This paper presents a methodology to directly observe the fractured contact surface between the cold sprayed particle and substrate. By this means, the particle/substrate fractured contact surfaces at different spray angles were obtained and analyzed. It was found that in the perpendicular spray dimple-like features as a sign of metallurgical bonding were formed at the surrounding of the central region on the fractured contact surface. However, for the angular spray, such dimple-like features only located at a small area of one side. Further analysis suggested that the high contact pressure is the dominant factor determining the particle/substrate metallurgical bonding quality and thus the formation of dimple-like features. (C) 2016 Elsevier B.V. All rights reserved.
引用
收藏
页码:76 / 79
页数:4
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