Selective sublimation of GaN and regrowth of AlGaN to co-integrate enhancement mode and depletion mode high electron mobility transistors

被引:0
作者
Ngo, Thi Huong [1 ]
Comyn, Remi [1 ]
Chenot, Sebastien [1 ]
Brault, Julien [1 ]
Nemoz, Maud [1 ]
Vennegues, Philippe [1 ]
Damilano, Benjamin [1 ]
Vezian, Stephane [1 ]
Frayssinet, Eric [1 ]
Cozette, Flavien [2 ]
Defrance, Nicolas [3 ]
Lecourt, Francois [4 ]
Labat, Nathalie [5 ]
Maher, Hassan [2 ]
Cordier, Yvon [1 ]
机构
[1] Univ Cote Azur, CNRS, CRHEA, Rue Bernard Gregory, F-06560 Valbonne, France
[2] Univ Sherbrooke, Lab Nanotechnol Nanosyst, CNRS, UMI 3463,3IT, 3000 Bd Univ, Sherbrooke J1K OA5, PQ, Canada
[3] Univ Lille, CNRS, UMR8520, IEMN, Ave Poincare, F-59650 Villeneuve Dascq, France
[4] OMMIC, 2 Rue Moulin, F-94450 Limeil Brevannes, France
[5] Univ Bordeaux, Lab Integrat Mat Syst, Talence, France
关键词
Selective sublimation; Local area epitaxy; Group III -nitrides; High electron mobility transistors; MOLECULAR-BEAM EPITAXY; HEMTS; OPERATION; GROWTH; HFET;
D O I
10.1016/j.jcrysgro.2022.126779
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
In the present study, the selective sublimation of the p-GaN cap layer of Al(Ga)N/GaN HEMTs is developed to replace the commonly used dry etching with no risk of damage in the barrier layer in order to fabricate enhanced mode transistors. Thanks to this approach, enhancement-mode transistors are fabricated with a threshold voltage between 0 V and +1.5 V depending on the barrier layer aluminum molar fraction and thickness. Furthermore, we show the benefit of the combination of selective sublimation with the regrowth of AlGaN to reduce access resistance in these transistors which can be co-integrated with depletion-mode devices fabricated in the same process in areas where p-GaN has been totally evaporated.
引用
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页数:7
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