Board level drop test reliability for MCP package

被引：0
|
作者：
Zhang Jing [1 ]
Du Maohua [1 ]
Feng Nufeng [1 ]
Taekoo, Lee [1 ]
机构：
[1] Samsung Semicond China R&D Co Ltd, Room B-404,Int Sci Pk, Suzhou 215021, Peoples R China
来源：
ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS | 2006年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
With the increasing requirement of thinner, higher density and multi-function product, MCP (Multi Chip Package) is becoming a more and more popular package. And for application in handheld systems, the package's resistance to drop impact becomes especially important. This study uses a simple DAQ system for the drop test according to JEDEC standard, discusses the effects of substrate pad denting, solder ball composition, and mold thickness on the reliability life, and through failure analysis the failure mechanism is explained.
引用
收藏
页码：778 / +
页数：2
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