Microstructure and tensile properties of Sn-9Zn-xAg lead-free solder alloys

被引：84

作者：

Song, JM ^{[1
]}

Lan, GF ^{[1
]}

Lui, TS ^{[1
]}

Chen, LH ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan

来源：

SCRIPTA MATERIALIA | 2003年 / 48卷 / 08期

关键词：

Sn-Zn-Ag; microstructure; mechanical properties;

D O I：

10.1016/S1359-6462(02)00647-4

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Microstructural features and tensile properties of Sn-Zn eutectic alloys with varying Ag content were examined in this study. Results indicate that the main effects of Ag addition were reduced strength and greater ductility due to the differences in the morphology and distribution of second phase particles. Also, a modified structure caused by rapid solidification resulted in better tensile properties. (C) 2003 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.

引用

页码：1047 / 1051

页数：5

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