Multiple Dice Working as One: CAD Flows and Routing Architectures for Silicon Interposer FPGAs

Large field-programmable gate array (FPGA) systems with multiple dice connected by a silicon interposer are now commercially available. However, many questions remain concerning their key architecture parameters and efficiency, as the signal count between dice is reduced and the delay between the dice is increased compared with a monolithic FPGA. We modify the versatile place and route (VPR) to target interposer-based FPGAs and investigate placement and routing changes and incorporating partitioning into the flow to improve results. Our best computer-aided design (CAD) flow reduces the routing demand for interposer FPGAs with realistic connectivity between dice by 47% and improves the circuit speed by 13% on average. Architecture modifications to add routing flexibility when crossing the interposer are very beneficial and improve routability by a further 11%. With these CAD and architecture enhancements, we find that if an interposer supplies (between dice) 20% of the routing capacity that the normal (within-die) FPGA routing channels supply, there is only a modest impact on circuit routability. Smaller interposer-routing capacities do impact routability; however, minimum channel width increases by 70% when an interposer supplies only 10% of the within-die routing. The interposer also impacts delay, increasing circuit delay by 11% on average for a 1-ns interposer signal delay and a two-die system.