Heat transfer performance of a cooling system using vibrating piezoelectric beams

被引:14
作者
Wu, T [1 ]
Ro, PI [1 ]
机构
[1] N Carolina State Univ, Dept Mech & Aerosp Engn, Raleigh, NC 27695 USA
关键词
D O I
10.1088/0960-1317/15/1/030
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A prototype of a miniature cooling system for microelectronics using vibrating piezoelectric beam was proposed and constructed. The flow patterns and cooling effects of the system were investigated experimentally. The vibration characteristics of the piezoelectric beam were simulated by the finite element method. Cooling effects were measured in terms of the temperature drop of the heat source above the vibrating beam. The electric field applied on the piezoelectric beam and the gap between heat source and actuator were adjusted to find the best cooling result. A temperature drop of 25.9 degreesC from 92 degreesC can be observed for the heat source when operating at a certain condition, which indicates the feasibility of using the present miniature cooling system in small devices. The heat transfer performance of the cooling system was analyzed as well. The results show that the enhancement of heat transfer between the heat source and the beam can be up to 210% with the acoustic streaming generated by the beam vibration in the present experimental studies. The enhanced heat transfer can be attributed to the generation of vortical streaming by the vibrating beam which was also captured in the flow visualization experiments.
引用
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页码:213 / 220
页数:8
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