Methods for Conceptual Thermal Design

被引:1
作者
Strijk, Ruben [1 ]
Brezet, Han [1 ]
Vergeest, Joris [1 ]
机构
[1] Delft Univ Technol, Fac Ind Design Engn, NL-2628 CE Delft, Netherlands
关键词
D O I
10.1080/01457630903408318
中图分类号
O414.1 [热力学];
学科分类号
摘要
This article describes three generic models and application methods that can be used to analyze temperature development in an electronic product during conceptual design. The models are based on generally known heat transfer and resistor-capacitor network theory and are theoretically and numerically approximated. The result is three easy-to-use tools for conceptual thermal design. Application of the models in design practice has been assessed using a usability experiment and several in-depth interviews with industrial design engineers from the field.
引用
收藏
页码:433 / 448
页数:16
相关论文
共 16 条
[1]  
*FLIR SYST, THERM RES
[2]  
Holman J.P., 2002, Heat transfer
[3]  
*INFR SERV INC, EM VAL COMM MAT
[4]  
ISHIZUKA M, 2000, 7 INT C THERM THERM, P99
[5]  
Joshi Y, 2003, MICROELECTRON J, V34, P1195, DOI [10.1016/S0026-2692(03)00200-3, 10.1016/S0026-2692(03)0020-3]
[6]  
Karnopp D., 1990, SYSTEM DYNAMICS UNIF, VSecond
[7]  
Remsburg R., 2001, ELECTR HBK SERIES
[8]  
Smith P.G., 1998, DEV PRODUCTS HALF TI
[9]  
STRIJK R, 2008, P 7 INT S TOOLS METH, P691
[10]  
STRIJK R, 2008, THESIS FACULTY IND D