Solid state interfacial reactions in electrodeposited Ni/Sn couples

被引：19

作者：

Tang, Wen-ming ^{[1
]}

He, An-qiang ^{[2
]}

Liu, Qi ^{[2
]}

Ivey, Douglas-G. ^{[2
]}

机构：

[1] Hefei Univ Technol, Dept Mat Sci & Engn, Hefei 230009, Peoples R China

[2] Univ Alberta, Dept Chem & Mat Engn, Edmonton, AB T6G 2G6, Canada

来源：

INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS | 2010年 / 17卷 / 04期

基金：

加拿大自然科学与工程研究理事会;

关键词：

electrodeposition; solid state reaction; diffusion; microstructure; kinetics; INTERMETALLIC COMPOUND GROWTH; THIN-FILM COUPLES; LEAD-FREE SOLDERS; DIFFUSION COUPLES; NI; SN; CU; BEHAVIOR;

D O I：

10.1007/s12613-010-0341-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Ni/Sn couples, prepared by sequentially electroplating Ni layers and Sn layers on metallized Si wafers, were employed to study the microstructures and growth kinetics of Ni-Sn intermediate phases, when the Ni/Sn couples were aged at room temperature or annealed at temperatures from 150 to 225 degrees C for various times. The results show that the NiSn phase and Ni(3)Sn(4) phase are formed, respectively, in the aged couples and annealed couples. The Ni(3)Sn(4) layer is continuously distributed between the Ni and Sn sides in the annealed Ni/Sn couples. The Ni(3)Sn(4) growth follows parabolic growth kinetics with an apparent activation energy of 39.0 kJ/mol.

引用

页码：459 / 463

页数：5

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