共 30 条
- [5] Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 7 (03): : 412 - 423
- [7] Falck J, 2017, IEEE IND ELEC, P7923, DOI 10.1109/IECON.2017.8217389
- [8] Fischer K., 2015, P EWEA C PAR FRANC, P117
- [9] Ghimire P., P 2013 15 EUR C POW, P1
- [10] KABZA H, 1994, ISPSD '94 - PROCEEDINGS OF THE 6TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, P9, DOI 10.1109/ISPSD.1994.583620