Effect of temperature on wetting kinetics in Al/SiC system: a molecular dynamic investigation

被引:13
|
作者
Yang, Yao [1 ,2 ]
Li, Shaorong [2 ]
Liang, Yuxin [1 ,2 ]
Li, Bangsheng [1 ,2 ,3 ]
机构
[1] Harbin Inst Technol, Mat Sci & Engn, Harbin, Heilongjiang, Peoples R China
[2] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin, Heilongjiang, Peoples R China
[3] Harbin Inst Technol, Sch Mat Sci & Engn, Natl Key Lab Precis Hot Proc Met, Harbin, Heilongjiang, Peoples R China
基金
中国国家自然科学基金;
关键词
Contact angle; molecular dynamics); interfacial energy; diffusion coefficients; LIQUID ALUMINUM; SILICON-CARBIDE; SURFACE-TENSION; CONTACT ANGLES; WETTABILITY; AL; COPPER; ALLOY; EVAPORATION; BEHAVIOR;
D O I
10.1080/09276440.2019.1670001
中图分类号
TB33 [复合材料];
学科分类号
摘要
It is well known that liquid Al wetting on a SiC substrate is an important process, especially when manufacturing Al/SiC composite materials. Many researchers have attempted to investigate Al/SiC wetting kinetics; however, it is difficult since Al/SiC wetting occurs at high temperatures. It was found that the measured results showed diverse Al/SiC contact angles. Under such circumstances, molecular dynamic (MD) simulations were performed for spreading of Al/SiC and Al-12 at.%Si/SiC, each process merged with heating at 973-1533 K, by which qualitative analysis of temperature effects on atomic distribution, dissolution, and composition were made, those results demonstrated that the temperature change dominated the kinetics of Al/SiC wetting. In accordance with reactive wetting mechanisms, thermal energy successively activated liquid/solid dissolution and interactions in Al/SiC. Increased temperature was attributed to the enhancement of Al/SiC wettability through the increased Al diffusion coefficient.
引用
收藏
页码:587 / 600
页数:14
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