MOS devices;
n-type GaN;
photoelectrochemical (PEC) oxidation;
D O I:
10.1109/LED.2002.807711
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
We report on a SiO2 -Ga2O3 gate insulator stack directly grown on n-type GaN by the photoelectrochemical oxidation method. The resultant MOS devices are fabricated using the standard photolithography technique and liftoff technique. The effect of annealing temperature on the SiO2-Ga2O3/n-type GaN MOS devices are investigated. The properties of high breakdown field, low gate leakage current, and low interface state density were obtained for the MOS devices.