GaN MOS device using SiO2-Ga2O3 insulator grown by photoelectrochemical oxidation method

被引:48
作者
Lee, CT [1 ]
Lee, HY [1 ]
Chen, HW [1 ]
机构
[1] Natl Cent Univ, Inst Opt Sci, Chungli 32054, Taiwan
关键词
MOS devices; n-type GaN; photoelectrochemical (PEC) oxidation;
D O I
10.1109/LED.2002.807711
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report on a SiO2 -Ga2O3 gate insulator stack directly grown on n-type GaN by the photoelectrochemical oxidation method. The resultant MOS devices are fabricated using the standard photolithography technique and liftoff technique. The effect of annealing temperature on the SiO2-Ga2O3/n-type GaN MOS devices are investigated. The properties of high breakdown field, low gate leakage current, and low interface state density were obtained for the MOS devices.
引用
收藏
页码:54 / 56
页数:3
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