Using life-cycle information for reliability assessment of electronic assemblies

被引：0

作者：

Middendorf, A ^{[1
]}

Griese, H ^{[1
]}

Reichl, H ^{[1
]}

Grimm, WM ^{[1
]}

机构：

[1] Tech Univ Berlin, D-13355 Berlin, Germany

来源：

2002 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP - FINAL REPORT | 2002年

关键词：

life-time information module; reliability;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes the modular concept of a Lifetime Information Module (LIM) for reliability assessment and lifetime estimation of electronic components. The LIM consists of a data logger and a data processing setup for computing the reliability of individual electronic products, which are subject to different use conditions. It is designed for realizing novel failure prediction and lifetime estimation methods.

引用

页码：176 / 179

页数：4

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