Review of applications and developments of ultra-thin micro heat pipes for electronic cooling

被引：391
作者：
Tang, Heng [1 ]
Tang, Yong [1 ]
Wan, Zhenping [1 ]
Li, Jie [1 ]
Yuan, Wei [1 ]
Lu, Longsheng [1 ]
Li, Yong [1 ]
Tang, Kairui [2 ]
机构：
[1] South China Univ Technol, Sch Mech & Automot Engn, Intelligent Mfg Engn Lab Funct Struct & Device Gu, Guangzhou 510640, Guangdong, Peoples R China
[2] Penn State Univ, Mech Engn, Harrisburg, PA 17057 USA
来源：
APPLIED ENERGY | 2018年 / 223卷
基金：
中国国家自然科学基金;
关键词：
Ultra-thin micro heat pipes; Wick structures; Thermal management; Electronic cooling; THERMAL PERFORMANCE; CAPILLARY CHARACTERIZATION; GROOVED WICKS; LOOP; FABRICATION; EVAPORATOR; CONFIGURATION; TECHNOLOGIES; CONDENSER; OPERATION;
D O I：
10.1016/j.apenergy.2018.04.072
中图分类号：
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号：
0807 ; 0820 ;
摘要：
The development of miniaturization and high-density packaging of electronic components demands heat dissipation components that are compact and exhibit high performance. An ultra-thin micro heat pipe (UTHP), as a novel heat pipe with a flat shape that is highly suitable for application with high power and limited heat dissipation space, has been extensively investigated and widely used in mobile electronics. Understanding the influence of the manufacturing processes, capillary wick structures and flattened thickness on the thermal performance of UTHPs has been the aim of numerous studies. This paper presents a comprehensive review of the recent developments and applications of UTHPs for thermal management of electronics. The different types and applications of UTHPs are introduced, and the packaging technologies of UTHPs are summarized and compared. Furthermore, the fabrication methodology and heat transfer characteristics of various wick structures used for UTHPs are reviewed and analysed in detail. Finally, the challenges affecting the development and application of UTHPs are outlined, and recommendations for future research are presented.
引用
收藏
页码：383 / 400
页数：18
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