Characterization and Analysis of Insulated Metal Substrate-Based SiC Power Module for Traction Application

被引:0
作者
Chowdhury, Shajjad [1 ]
Gurpinar, Emre [1 ]
Ozpineci, Burak [1 ]
机构
[1] Oak Ridge Natl Lab, Power Elect & Elect Machinery Grp, One Bethel Valley Rd, Oak Ridge, TN 37830 USA
来源
2020 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE) | 2020年
关键词
Insulated metal substrate (IMS); high-power traction inverter; SiC power module; drive cycle analysis;
D O I
暂无
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
This paper presents the electrical characterization and drive cycle-based thermal analysis of an insulated metal substrate (IMS)-based silicon carbide power module for high-power traction inverters. The substrate was constructed using a thin layer of polymer-ceramic blend dielectric material with a thick copper core to improve transient thermal performance. The cooling performance of this module has already been validated with promising results. In this paper, an experimental test bed was set up to evaluate the dynamic and static electrical performance of the designed module under a wide range of operating conditions. The characterization results were then used to develop a drive cycle-based thermal model to validate the performance compared to the traditional direct bonded copper-based power module. The results indicate that the IMS-based power module is a suitable solution for high-power traction applications.
引用
收藏
页码:195 / 202
页数:8
相关论文
共 17 条
  • [1] [Anonymous], 2016, BENCHMARKING EV HEV
  • [2] [Anonymous], 2017, ELECT PERFORMANCE RE
  • [3] Enabling Technologies for Compact Integrated Electric Drives for Automotive Traction Applications
    Chowdhury, Shajjad
    Gurpinar, Emre
    Su, Gui-Jia
    Raminosoa, Tsarafidy
    Burress, Timothy A.
    Ozpineci, Burak
    [J]. 2019 IEEE TRANSPORTATION ELECTRIFICATION CONFERENCE AND EXPO (ITEC), 2019,
  • [4] Modeling and Reduction of Conducted EMI of Inverters With SiC JFETs on Insulated Metal Substrate
    Gong, Xun
    Josifovic, Ivan
    Ferreira, Jan Abraham
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2013, 28 (07) : 3138 - 3146
  • [5] Gong X, 2012, IEEE ENER CONV, P629, DOI 10.1109/ECCE.2012.6342762
  • [6] Gurpinar E., INT TECHN C EXH PACK
  • [7] Gurpinar E., 2020, IEEE T POWER ELECT
  • [8] Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules
    Gurpinar, Emre
    Ozpineci, Burak
    Chowdhury, Shajjad
    [J]. JOURNAL OF ELECTRONIC PACKAGING, 2020, 142 (04)
  • [9] Guzzella L.S., 2005, VEHICLE PROPULSION S
  • [10] Thermal Characterization of Insulated Metal Substrates with a Power Test Chip
    Jorda, X.
    Perpina, X.
    Vellvehi, M.
    Millan, J.
    Ferriz, A.
    [J]. 2009 21ST INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, 2009, : 172 - +