Modeling of Crosstalk Induced Effects in Nanoscale Copper Interconnects

Due to continued scaling of feature sizes, signal integrity and performance of today's copper based nanoscale interconnects are severely impacted. In this work, an ABCD parameter based model is presented for fast and accurate estimation of crosstalk delay and noise for identically coupled copper based nano-interconnect systems. Using the proposed analytical model, the crosstalk delay and noise are estimated in copper based nano-interconnects for intermediate and global interconnects at the future Integrated circuit technology nodes of 21 nm and 15 nm respectively. The proposed model has been compared with SPICE and it is found that both the crosstalk delay and noise model are almost 100% accurate as SPICE and in an average similar to 22 times and similar to 40 times faster than SPICE respectively.