Precise measurement of the wafer circuit width using computer vision

被引：0

作者：

Wang Guitang ^{[1
]}

Liu Runyu ^{[1
]}

Wu Liming ^{[1
]}

Deng Yaohua ^{[1
]}

机构：

[1] Guangdong Univ Technol, Sch Informat Engn, Guangzhou 510006, Peoples R China

来源：

ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS | 2006年

关键词：

wafer; standard ruler; spatial moment; sub-pixel; calibration1;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A method of measuring the two-dimension and nano-width of wafer with fast speed and high precision level of sub-pixel width is offered in this paper. This method takes two steps: Firstly, utilizing the standard ruler to fast measure the pending size with per-pixel level of precision; secondly, utilizing the technology of spatial moment pixel subdivision to precisely locate the edge pixels of pending graph, achieving sub-pixel level of precision. We apply this method to measure and validate one welding-plate among the wafers. The result indicates that the measuring precision has been improved significantly and it can satisfy the requirement of the wafer's CD measurement and calibration.

引用

页码：668 / +

页数：2