The 7-in. freestanding diamond thermal conductive film fabricated by DC arc Plasma Jet CVD with multi-stage magnetic fields

被引:15
作者
Huang, Yabo [1 ]
Chen, Liangxian [1 ]
Shao, Siwu [1 ]
Huang, Ke [1 ]
An, Kang [1 ]
Zheng, Yuting [1 ]
Liu, Jinlong [1 ]
Wei, Junjun [1 ]
Li, Chengming [1 ]
机构
[1] Univ Sci & Technol Beijing, Inst Adv Mat & Technol, State Key Lab Adv Met & Mat, Beijing 100083, Peoples R China
关键词
DC arc plasma jet CVD; High thermal conductive; Large-size diamond film; The magnetic field;
D O I
10.1016/j.diamond.2021.108812
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Diamond has attracted increasing attention because it has high thermal conductive. Here, a freestanding diamond thermal conductive film with a diameter of about 7 in. and an average thickness of 1.54 mm was prepared by DC arc plasma jet CVD with multi-stage magnetic fields. Specifically, the thickness uniformity was ensured by adding the magnetic field during the deposition of the freestanding diamond film. The morphology, structure and thermal conductivity of the diamond film were studied. The results showed that the expansion area of the DC arc plasma approached the surface of the substrate increasing duo to add the bottom magnetic field. Structural characterization revealed that the grain of the diamond film in the arc main were coarse, affected by the shape of DC arc plasma, while in the arc center and edge were fine. The main orientation of polycrystalline structure of the diamond film was the crystalline plane of (220). The Raman peaks of diamond film in different areas moved to a higher wavelength, indicating the existence of compressive stress inside the diamond film. The coarse columnar grain and a few grain boundaries were in the arc main. Therefore, the average value of the thermal conductivity (k(&updatedExpOTTOM;)) of diamond film measured in the arc main was 1728.9 +/- 4.9 W/(m.k). Meanwhile, the thermal conductivity of the arc center and edge area was lower than that of the arc main.
引用
收藏
页数:6
相关论文
共 28 条
[1]   QUANTITATIVE MEASUREMENT OF RESIDUAL BIAXIAL STRESS BY RAMAN-SPECTROSCOPY IN DIAMOND GROWN ON A TI ALLOY BY CHEMICAL-VAPOR-DEPOSITION [J].
AGER, JW ;
DRORY, MD .
PHYSICAL REVIEW B, 1993, 48 (04) :2601-2607
[2]   Fracture behavior of diamond films deposited by DC arc plasma jet CVD [J].
An, Kang ;
Chen, Liangxian ;
Yan, Xiongbo ;
Jia, Xin ;
Zhao, Yun ;
Zheng, Yuting ;
Liu, Jinlong ;
Wei, Junjun ;
Lu, Fanxiu ;
Li, Chengming .
CERAMICS INTERNATIONAL, 2018, 44 (11) :13402-13408
[3]   The 8-inch free-standing CVD diamond wafer fabricated by DC-PACVD [J].
Chae, Ki-Woong ;
Baik, Young-Joon ;
Park, Jong-Keuk ;
Lee, Wook-Seong .
DIAMOND AND RELATED MATERIALS, 2010, 19 (10) :1168-1171
[4]   Optical, thermal and mechanical properties of CVD diamond [J].
Coe, SE ;
Sussmann, RS .
DIAMOND AND RELATED MATERIALS, 2000, 9 (9-10) :1726-1729
[5]  
Francis D., 2007, Proc. CS MANTECH, V2007, P133
[6]   Anisotropic biaxial stresses in diamond films by polarized Raman spectroscopy of cubic polycrystals [J].
Gries, T. ;
Vandenbulcke, L. ;
Simon, P. ;
Canizares, A. .
JOURNAL OF APPLIED PHYSICS, 2008, 104 (02)
[7]   Structural evolution of Ti destroyable interlayer in large-size diamond film deposition by DC arc plasma jet [J].
Guo, Jianchao ;
Li, Chengming ;
Liu, Jinlong ;
Wei, Junjun ;
Chen, Liangxian ;
Hua, Chenyi ;
Yan, Xiongbo .
APPLIED SURFACE SCIENCE, 2016, 370 :237-242
[8]   Nanotwinned diamond with unprecedented hardness and stability [J].
Huang, Quan ;
Yu, Dongli ;
Xu, Bo ;
Hu, Wentao ;
Ma, Yanming ;
Wang, Yanbin ;
Zhao, Zhisheng ;
Wen, Bin ;
He, Julong ;
Liu, Zhongyuan ;
Tian, Yongjun .
NATURE, 2014, 510 (7504) :250-+
[9]   Argon-to-hydrogen ratio in plasma jet diamond chemical vapour deposition [J].
Huang, TB ;
Tang, WZ ;
Lu, FX ;
Gracio, J ;
Ali, N .
SURFACE & COATINGS TECHNOLOGY, 2005, 190 (01) :48-53
[10]   Impact of deposition temperature on microstructure and properties of erbium oxide antireflective films deposited on CVD diamond substrates [J].
Huang, Yabo ;
Chen, Liangxian ;
Shao, Siwu ;
Zhu, Xiaohua ;
Huang, Ke ;
An, Kang ;
Zheng, Yuting ;
Liu, Jinlong ;
Wei, Junjun ;
Li, Chengming .
VACUUM, 2021, 193