AlN/GaN heterostructures, with different AlN barrier thicknesses (3 and 6 nm), are characterized using atomic force microscopy, high-resolution transmission electron microscopy, photoluminescence, and Hall effect measurements. Based on the measured results, we suggest that with increased AlN barrier thickness, the tensile strain in the AlN barrier layer is relaxed by crack channels. In addition, the strain-induced cracking also greatly penetrated into the GaN buffer layer, and resulted in the relaxation of the compressive strain and the increase of the defects in the GaN buffer layer. This caused AlN/GaN heterostructure quality deterioration and introduced additional scattering.
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Univ Notre Dame, Notre Dame, IN 46556 USAUniv Notre Dame, Notre Dame, IN 46556 USA
Qi, Meng
Li, Guowang
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Univ Notre Dame, Notre Dame, IN 46556 USAUniv Notre Dame, Notre Dame, IN 46556 USA
Li, Guowang
Protasenko, Vladimir
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Univ Notre Dame, Notre Dame, IN 46556 USAUniv Notre Dame, Notre Dame, IN 46556 USA
Protasenko, Vladimir
Zhao, Pei
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Univ Notre Dame, Notre Dame, IN 46556 USAUniv Notre Dame, Notre Dame, IN 46556 USA
Zhao, Pei
Verma, Jai
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Univ Notre Dame, Notre Dame, IN 46556 USAUniv Notre Dame, Notre Dame, IN 46556 USA
Verma, Jai
Song, Bo
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Univ Notre Dame, Notre Dame, IN 46556 USAUniv Notre Dame, Notre Dame, IN 46556 USA
Song, Bo
Ganguly, Satyaki
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Univ Notre Dame, Notre Dame, IN 46556 USAUniv Notre Dame, Notre Dame, IN 46556 USA
Ganguly, Satyaki
Zhu, Mingda
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Univ Notre Dame, Notre Dame, IN 46556 USAUniv Notre Dame, Notre Dame, IN 46556 USA
Zhu, Mingda
Hu, Zongyang
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Univ Notre Dame, Notre Dame, IN 46556 USAUniv Notre Dame, Notre Dame, IN 46556 USA
Hu, Zongyang
Yan, Xiaodong
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Univ Notre Dame, Notre Dame, IN 46556 USAUniv Notre Dame, Notre Dame, IN 46556 USA
Yan, Xiaodong
Mintairov, Alexander
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Univ Notre Dame, Notre Dame, IN 46556 USA
Russian Acad Sci, AF Ioffe Phys Tech Inst, St Petersburg 194021, RussiaUniv Notre Dame, Notre Dame, IN 46556 USA
Mintairov, Alexander
Xing, Huili Grace
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Univ Notre Dame, Notre Dame, IN 46556 USAUniv Notre Dame, Notre Dame, IN 46556 USA
Xing, Huili Grace
Jena, Debdeep
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Univ Notre Dame, Notre Dame, IN 46556 USAUniv Notre Dame, Notre Dame, IN 46556 USA
机构:
Science and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research InstituteScience and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research Institute
蔡树军
敦少博
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Science and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research InstituteScience and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research Institute
敦少博
刘波
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Science and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research InstituteScience and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research Institute
刘波
尹甲运
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Science and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research InstituteScience and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research Institute
尹甲运
张雄文
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Science and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research InstituteScience and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research Institute
张雄文
房玉龙
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Science and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research InstituteScience and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research Institute
房玉龙
林兆军
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School of Physics,Shandong UniversityScience and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research Institute
林兆军
孟令国
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School of Physics,Shandong UniversityScience and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research Institute
孟令国
栾崇彪
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School of Physics,Shandong UniversityScience and Technology on Application Specific Integrated Circuit Laboratory,Hebei Semiconductor Research Institute