AlN/GaN heterostructures, with different AlN barrier thicknesses (3 and 6 nm), are characterized using atomic force microscopy, high-resolution transmission electron microscopy, photoluminescence, and Hall effect measurements. Based on the measured results, we suggest that with increased AlN barrier thickness, the tensile strain in the AlN barrier layer is relaxed by crack channels. In addition, the strain-induced cracking also greatly penetrated into the GaN buffer layer, and resulted in the relaxation of the compressive strain and the increase of the defects in the GaN buffer layer. This caused AlN/GaN heterostructure quality deterioration and introduced additional scattering.
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Univ Montpellier, CNRS, Lab Charles Coulomb, UMR 5221, CC 074, FR-34095 Montpellier, France
Anna Univ, Ctr Crystal Growth, Madras 600025, Tamil Nadu, IndiaUniv Montpellier, CNRS, Lab Charles Coulomb, UMR 5221, CC 074, FR-34095 Montpellier, France
Jayasakthi, M.
Juillaguet, S.
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Univ Montpellier, CNRS, Lab Charles Coulomb, UMR 5221, CC 074, FR-34095 Montpellier, FranceUniv Montpellier, CNRS, Lab Charles Coulomb, UMR 5221, CC 074, FR-34095 Montpellier, France
Juillaguet, S.
Peyre, H.
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Univ Montpellier, CNRS, Lab Charles Coulomb, UMR 5221, CC 074, FR-34095 Montpellier, FranceUniv Montpellier, CNRS, Lab Charles Coulomb, UMR 5221, CC 074, FR-34095 Montpellier, France
Peyre, H.
Konczewicz, L.
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Univ Montpellier, CNRS, Lab Charles Coulomb, UMR 5221, CC 074, FR-34095 Montpellier, FranceUniv Montpellier, CNRS, Lab Charles Coulomb, UMR 5221, CC 074, FR-34095 Montpellier, France
Konczewicz, L.
Baskar, K.
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Anna Univ, Ctr Crystal Growth, Madras 600025, Tamil Nadu, India
Manonmaniam Sundaranar Univ, Tirunelveli 627012, IndiaUniv Montpellier, CNRS, Lab Charles Coulomb, UMR 5221, CC 074, FR-34095 Montpellier, France
Baskar, K.
Contreras, S.
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Univ Montpellier, CNRS, Lab Charles Coulomb, UMR 5221, CC 074, FR-34095 Montpellier, FranceUniv Montpellier, CNRS, Lab Charles Coulomb, UMR 5221, CC 074, FR-34095 Montpellier, France