SU-8-Induced Strong Bonding of Polymer Ligands to Flexible Substrates via in Situ Cross-Linked Reaction for Improved Surface Metallization and Fast Fabrication of High-Quality Flexible Circuits

被引：41

作者：

Hu, Mingjun ^{[1
]}

Guo, Qiuquan ^{[1
]}

Zhang, Tengyuan ^{[1
]}

Zhou, Shaolin ^{[2
]}

Yang, Jun ^{[1
]}

机构：

[1] Univ Western Ontario, Dept Mech & Mat Engn, London, ON N6A 5B9, Canada

[2] S China Univ Technol, Dept Elect & Informat Engn, Guangzhou 510641, Guangdong, Peoples R China

来源：

ACS APPLIED MATERIALS & INTERFACES | 2016年 / 8卷 / 07期

基金：

加拿大自然科学与工程研究理事会;

关键词：

surface modification; P4VP; SU-8; epoxy; electroless plating; flexible electronics; pyridine ligand; laser printer; COPPER PATTERNS; ELECTROLESS; ELECTRONICS; PLASMA; 4-VINYLPYRIDINE; NANOPARTICLES; RESOLUTION; PLATFORMS; PYRIDINE); ADHESION;

D O I：

10.1021/acsami.5b10406

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

On account of in situ cross-linked reaction of epoxy SU-8 with poly(4-vinylpyridine) (P4VP) and its strong reactive bonding ability with different pretreated substrates, we developed a simple universal one-step solution-based coating method for fast surface modification of various objects. Through this method, a layer of P4VP molecules with controllable thickness can be tethered tightly onto substrates with the assistance of SU-8. P4VP molecules possess a lot of pyridine ligands to immobilize transitional metal ions that can behave as the catalyst of electroless copper plating for surface metallization while functioning as the adhesion-promoting layer between the substrate and deposited metal. Attributed to interpenetrated entanglement of P4VP molecules and as-deposited metal, ultrathick (>7 mu m) strongly adhesive high-quality copper layer can be formed on flexible substrates without any delamination. Then through laser printer to print toner mask, a variety of designed circuits can be easily fabricated on modified flexible PET substrate.

引用

页码：4280 / 4286

页数：7