Microstructure and interfacial reactions of soldering magnesium alloy AZ31B

被引:10
作者
Liu, Liming [1 ]
Wu, Zhonghui [1 ]
机构
[1] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China
关键词
Microstructure; Soldering; Magnesium alloy; Fracture morphology;
D O I
10.1016/j.matchar.2009.09.015
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, economic and innoxious solder alloys with low melting temperature were designed for AZ31B. Their chemical composition and relevant parameters were investigated for a high-performance structure of bonding region. Results of microstructure observation showed that Zn-enriched phases disappeared and alpha-Mg existed in the joints in the form of coarse dendrites by increasing the concentration of Mg in the solder alloys. Water cooling with a high cooling rate was adopted in experiments. Experimental research showed that high cooling rate restricted the grains of a-Mg as the equiaxed dendrites, which was about 1/5 of the coarse dendrite but their number was more than 40-50 times. Both morphology with typical fracture and the analysis on X-ray diffraction fracture indicated that equiaxed dendrites significantly improved the mechanical property of the joints. Necking phenomenon occurred in the bonding region was in favor of the improvement of joint shear strength. (C) 2009 Elsevier Inc. All rights reserved.
引用
收藏
页码:13 / 18
页数:6
相关论文
共 15 条
[1]  
BUSK R.S., 1987, Magnesium products design
[2]  
Dahle AK, 2000, MATER FORUM, V24, P167
[3]  
Decker RF, 1998, ADV MATER PROCESS, V154, P31
[4]   Influence of quench and heating rates on the ageing response of an Al-Zn-Mg-(Zr) alloy [J].
Deschamps, A ;
Brechet, Y .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1998, 251 (1-2) :200-207
[5]  
LOCKWOOD L, 2007, BRAZING HDB AM WELD
[6]  
MARKOVA YI, 1994, WELD PROD, V23, P57
[7]  
MASUDA N, 2001, DVS BER, V212, P353
[8]  
MUECKLICH S, 2003, P 2 INT BRAZ SOLD C
[9]  
OATES WR, 1996, WELDING HDB, P154
[10]  
SAKKINEN D, 1995, ADV MATER PROCESS, P26