An analytical delay model for RLC interconnects

被引:0
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作者
Kahng, AB [1 ]
Muddu, S [1 ]
机构
[1] UNIV CALIF LOS ANGELES,DEPT COMP SCI,LOS ANGELES,CA 90095
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暂无
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TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
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页码:237 / 240
页数:4
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