Investigation of solder joints strength

被引：0
|
作者：
Vasko, Cyril [1 ]
Ohera, Jiri [1 ]
Szendiuch, Ivan [1 ]
机构：
[1] Tech Univ, Dept Microelect, Brno, Czech Republic
来源：
2006 29TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY | 2006年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper deals with method for finding mechanical properties of solder joint. Basic aim is practical realization one's select method namely shear strength finish of solder joint and their thermal fatigue variants on ceramic substrate. The test is execution on testing components soldered by tin-lead and lead-free solder. Acquired characteristic can subserve to definition influencing factors of strength and reliability soldered joint on ceramic substrate, primarily soldered by lead-free solder.
引用
收藏
页码：327 / +
页数：2
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