LOCAL THERMAL MEASUREMENTS OF IMPINGING LIQUID JETS WITH AN ANGLED CONFINING WALL FOR POWER ELECTRONICS COOLING

被引:0
作者
Maddox, John F. [1 ]
Knight, Roy W. [1 ]
Bhavnani, Sushi H. [1 ]
机构
[1] Auburn Univ, Dept Mech Engn, Auburn, AL 36849 USA
来源
INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 3 | 2015年
关键词
HEAT-TRANSFER; AIR-JET; ENHANCEMENT; IMPINGEMENT; ARRAY;
D O I
暂无
中图分类号
O414.1 [热力学];
学科分类号
摘要
The local surface temperature, heat flux, heat transfer coefficient, and Nusselt number were measured for an inline array of circular, normal jets of single-phase, liquid water impinging on a copper block with a common outlet for spent flow, and an experimental 2-D surface map was obtained by translating the jet array relative to the sensors. The effects of variation in jet height, jet pitch, confining wall angle, and average jet Reynolds number were investigated. A strong interaction between the effects of the geometric parameters was observed, and a 5 confining wall was seen to be an effective method of managing the spent flow for jet impingement cooling of power electronics. The maximum average heat transfer coefficient of 13,100 W/m(2)K and average Nusselt number of 67.7 were measured at an average jet Reynolds number of 14,000.
引用
收藏
页数:11
相关论文
共 20 条
[11]  
Narumanchi S., 2012, 13 IEEE INT C THERM
[12]   Heat transfer enhancement from micro pin fins subjected to an impinging jet [J].
Ndao, Sidy ;
Lee, Hee Joon ;
Peles, Yoav ;
Jensen, Michael K. .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2012, 55 (1-3) :413-421
[13]   Full-Field Flow Measurements and Heat Transfer of a Compact Jet Impingement Array With Local Extraction of Spent Fluid [J].
Onstad, Andrew J. ;
Elkins, Christopher J. ;
Moffat, Robert J. ;
Eaton, John K. .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2009, 131 (08) :1-8
[14]   A Thermal-Hydraulic Comparison of Liquid Microchannel and Impinging Liquid Jet Array Heat Sinks for High-Power Electronics Cooling [J].
Robinson, Anthony J. .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2009, 32 (02) :347-357
[15]  
Schulz-Harder J., 2008, 5th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, P1, DOI DOI 10.1109/MILCOM.2008.4753118
[16]   A review of IGBT models [J].
Sheng, K ;
Williams, BW ;
Finney, SJ .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2000, 15 (06) :1250-1266
[17]   Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module [J].
Wang, Peng ;
McCluskey, Patrick ;
Bar-Cohen, Avram .
JOURNAL OF ELECTRONIC PACKAGING, 2013, 135 (02)
[18]   Nozzle geometry effects in liquid jet array impingement [J].
Whelan, Brian P. ;
Robinson, Anthony J. .
APPLIED THERMAL ENGINEERING, 2009, 29 (11-12) :2211-2221
[19]   Heat transfer from an obliquely impinging circular air jet to a flat plate [J].
Yan, XJ ;
Saniei, N .
INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW, 1997, 18 (06) :591-599
[20]  
Zuckerman N., 2006, Advances in Heat Transfer, V39, P565, DOI DOI 10.1016/S0065-2717(06)39006-5