Experimental and numerical investigation on the heat transfer enhancement for Mini-channel heat sinks with tessellated fins

被引:20
作者
Cao, Xin [1 ,2 ]
Liu, Huan-ling [1 ,2 ]
Shao, Xiao-dong [1 ,2 ]
Shi, Hang-bo [3 ]
机构
[1] Xidian Univ, Sch Electromech Engn, Shaanxi Key Lab Space Solar Power Stn Syst, Xian 710071, Peoples R China
[2] Xidian Univ, Sch Electromech Engn, Key Lab Elect Equipment Struct Design, Minist Educ, Xian 710071, Peoples R China
[3] Xian Microelect Res Inst, Xian 710054, Peoples R China
关键词
Heat transfer; Mini-channel heat sink; Tessellated fins; Optimization; Nusselt number; Pressure drop; THERMAL MANAGEMENT; PERFORMANCE; DESIGN; ALGORITHM;
D O I
10.1016/j.applthermaleng.2022.118353
中图分类号
O414.1 [热力学];
学科分类号
摘要
Thermal management continues to be a constructive procedure applied to extend the life span in electronic equipment. In this paper, a novel mini-channel heat sink with tessellated fins is proposed with different arrangements of oblique channels width and slant angle of secondary channels and the heat cooling capacity of the mini-channel heat sink is investigated numerically and experimentally at the Reynolds number (Re) in the range of 573 to 2295. The results indicated that the new mini-channel heat sink with tessellated fins is more conductive to strengthen the heat transfer effect. The simulation results show that with the increase of volume flow rate, the temperature difference and pressure drop of the model bottom plate with tessellated fins decrease obviously. When the oblique channel slant angle is 70and the inclined flow channel width is 1.8 mm, the heat transfer effect of better quality can be achieved basically. By processing the single-objective and multi-objective genetic algorithm optimization, optimal designs is predicted and analyzed based on the two variables associated to the geometry of the channels. It is found that the optimized model promotes better thermal performance and uniform substrate temperature, i.e., the pressure drop can be reduced by up to 73%, the average Nusselt number can be raised by up to 17%, and the minimal temperature difference of 17 K at Q(v) = 30 ml/s. To the end, the error calculation proves that the multi-objective optimization results are in good agreement with the simulation results.
引用
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页数:18
相关论文
共 42 条
[1]   An experimental and numerical investigation of chevron fin structures in serpentine minichannel heat sinks [J].
Al-Neama, Ahmed F. ;
Khatir, Zinedine ;
Kapur, Nikil ;
Summers, Jonathan ;
Thompson, Harvey M. .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2018, 120 :1213-1228
[2]  
ASME, 2005, 1912013 ASME PTC
[3]   Experimental and numerical study on the performance of a minichannel heat sink with different header geometries using nanofluids [J].
Awais, Ahmad Ali ;
Kim, Man-Hoe .
APPLIED THERMAL ENGINEERING, 2020, 171
[4]   Experimental investigation of enhanced performance of pin fin heat sink with wings [J].
Choudhary, Vishwjeet ;
Kumar, Manoj ;
Patil, Anil Kumar .
APPLIED THERMAL ENGINEERING, 2019, 155 :546-562
[5]  
Coleman H. W., 2009, Uncertainty Analysis for Uncertainty Analysis for Engineers
[6]   Review on two-phase flow distribution in parallel channels with macro and micro hydraulic diameters: Main results, analyses, trends [J].
Dario, E. R. ;
Tadrist, L. ;
Passos, J. C. .
APPLIED THERMAL ENGINEERING, 2013, 59 (1-2) :316-335
[7]   CFD analysis of heat transfer enhancement in plate-fin heat sinks with fillet profile: Investigation of new designs [J].
Freegah, Basim ;
Hussain, Ammar A. ;
Falih, Abeer H. ;
Towsyfyan, Hossein .
THERMAL SCIENCE AND ENGINEERING PROGRESS, 2020, 17
[8]   Optimal shape design of a minichannel heat sink applying multi-objective optimization algorithm and three-dimensional numerical method [J].
Ge, Ya ;
Wang, Shicheng ;
Liu, Zhichun ;
Liu, Wei .
APPLIED THERMAL ENGINEERING, 2019, 148 :120-128
[9]   Numerical study on layout of micro-channel heat sink for thermal management of electronic devices [J].
Gong, Liang ;
Zhao, Jin ;
Huang, Shanbo .
APPLIED THERMAL ENGINEERING, 2015, 88 :480-490
[10]   Thermal Performance of Microchannels With Wavy Walls for Electronics Cooling [J].
Gong, Liang 'Jason' ;
Kota, Krishna ;
Tao, Wenquan ;
Joshi, Yogendra .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (07) :1029-1035