Multichannel optical modules compatible with the fiber-in-board technology

被引:6
作者
Depestel, G
Ambrosy, A
Tan, QS
Vrana, M
Migom, F
Richter, H
Vandewege, J
Vetter, P
机构
[1] ALCATEL SEL AG,D-70435 STUTTGART,GERMANY
[2] STATE UNIV GHENT,INTEC,B-9000 GHENT,BELGIUM
[3] STATE UNIV GHENT,ELIS,B-9000 GHENT,BELGIUM
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1996年 / 19卷 / 01期
关键词
fiber-in-board; silicon motherboard; thermo compression flip-chip bonding; fiber alignment; multichannel E/O modules; parallel optical interconnect;
D O I
10.1109/96.486493
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Fiber-in-board technology offers a full solution for high-speed parallel interconnections. Packaging techniques compatible with this board technology have been realized. Two different solutions are presented for the fiber alignment in the module, The first technique is based on a silicon motherboard bench with etched V-grooves and thermo compression flip-chip bonding, The second technique is based on a vacuum pick-up tool, capable of handling 16 multimode fibers, A dedicated alignment piece has been developed for interfacing the fibers towards the optical contact in the board, For the realization of electrical interconnections inside the module, three different substrate technologies are evaluated, First, prototypes were elaborated in a thin-film technology, For the electrical interface of the silicon motherboard a standard thick-film technology was used, A novel thick-film technology based on the FODEL(TM) material, which offers high density interconnection capabilities, was used for the development of an alternative packaging technique. The different modules were tested and integrated in a system demonstrator, Four parallel. on-board optical links were operational at 311 Mb/s, The speed was limited by the receiver electronics, which were designed for operation at 155 Mb/s.
引用
收藏
页码:116 / 123
页数:8
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